CMP, also known as chemical mechanical planarization, is a key process in semiconductor manufacturing. PEEK material has the characteristic of corrosion resistance, and when it comes into contact with chemical solutions, there is very little leaching of PEEK. This is crucial for the CMP process, as low leaching can prevent impurities from entering the polishing solution or adsorbing on the wafer surface, thereby preventing contamination of the wafer and ensuring high purity requirements for semiconductor manufacturing.
And PEEK has excellent friction resistance, with fewer particles generated by wear and will not contaminate the chip.
Matching of thermal expansion coefficient: The thermal expansion coefficient of PEEK material is more compatible with commonly used materials in semiconductor manufacturing, such as silicon. During the temperature change process of CMP technology, the thermal expansion and contraction of PEEK material and components such as wafers are similar, which can avoid component damage or wafer deformation caused by thermal stress mismatch, ensuring the reliability and repeatability of the process.
Carbon fiber reinforced anti-static PEEK can protect chips from electrostatic discharge damage, it also has excellent mechanical strength , which can effectively protect semiconductor chips.
